Curable resin composition, dry film, cured product and electronic component

The present invention provides: a curable resin composition which exhibits excellent resolution and higher insulation reliability, while having excellent embeddability into a circuit; a dry film; a cured product; and an electronic component which comprises the curable resin composition, the dry film...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	UETA, CHIHO, TANE, SHOTARO, SHIBATA, DAISUKE, SHIMADA, SAWAKO, KATO, FUMITAKA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The present invention provides: a curable resin composition which exhibits excellent resolution and higher insulation reliability, while having excellent embeddability into a circuit; a dry film; a cured product; and an electronic component which comprises the curable resin composition, the dry film or the cured product. A curable resin composition which contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a thermosetting resin and (D) silica, and which is characterized in that: the blending amount of the silica (D) is 0 to 60% by mass relative to the total solid content of the curable resin composition; the silica (D) contains (D-1) nanosilica; the nanosilica (D-1) has an average secondary particle diameter of 200 nm or less; and the degree of association of the nanosilica (D-1) is 2.3 or less.