Wiring board and method for manufacturing wiring board

A wiring board comprising: a board having transparency; a mesh wire portion disposed on the board and including a plurality of wires; and a dummy wire portion disposed around the mesh wire portion and including a plurality of dummy wires electrically independent from the wires. The mesh wire portion...

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Hauptverfasser:	IIOKA, HIDETOSHI, TAKE, SEIJI, IIMURA, KEITA, KAWAGUCHI, SHUJI, KINOSHITA, KAZUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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creator	IIOKA, HIDETOSHI TAKE, SEIJI IIMURA, KEITA KAWAGUCHI, SHUJI KINOSHITA, KAZUKI
description	A wiring board comprising: a board having transparency; a mesh wire portion disposed on the board and including a plurality of wires; and a dummy wire portion disposed around the mesh wire portion and including a plurality of dummy wires electrically independent from the wires. The mesh wire portion is composed of predetermined unit patterns repeatedly arranged along a first direction. In the first direction, the spacing between the mesh wire portion and the dummy wire portion is more than or equal to 0.01 times and less than or equal to 0.2 times the pitch of the unit patterns in the first direction.
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subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
title	Wiring board and method for manufacturing wiring board
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