Wiring board and method for manufacturing wiring board

Wiring board and method for manufacturing wiring board

A wiring board comprising: a board having transparency; a mesh wire portion disposed on the board and including a plurality of wires; and a dummy wire portion disposed around the mesh wire portion and including a plurality of dummy wires electrically independent from the wires. The mesh wire portion...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IIOKA, HIDETOSHI, TAKE, SEIJI, IIMURA, KEITA, KAWAGUCHI, SHUJI, KINOSHITA, KAZUKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A wiring board comprising: a board having transparency; a mesh wire portion disposed on the board and including a plurality of wires; and a dummy wire portion disposed around the mesh wire portion and including a plurality of dummy wires electrically independent from the wires. The mesh wire portion is composed of predetermined unit patterns repeatedly arranged along a first direction. In the first direction, the spacing between the mesh wire portion and the dummy wire portion is more than or equal to 0.01 times and less than or equal to 0.2 times the pitch of the unit patterns in the first direction.