Semiconductor package

Provided are: a device with which it is possible to perform, in a compact size and at a device level, pulse protection from a pulse having a sharp rise such as an electromagnetic pulse; and a semiconductor package to which the device is mounted. The semiconductor package (1, 2, 3) comprises: a substrate (12, 60, 70); an IC chip (21) disposed on the substrate (12, 60, 70); a plurality of connection parts (30) for connecting the IC chip (21) to the outside; a plurality of bonding wires (40) for connecting the IC chip (21) to the corresponding plurality of connection parts; and a mechanism for bypassing surge current having been applied to any one of the plurality of connection parts (30), from the connection part (30) to a ground potential through a path different from the plurality of bonding wires (40).