Heat source device, substrate support device and substrate processing facility

Heat source device, substrate support device and substrate processing facility

The present invention relates to a heat source device, a substrate support device, and a substrate processing facility comprising the same. According to the present invention, a substrate can be uniformly heated and stably supported by a chamber having an inner space where the substrate is treated,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SONG, DAE-SEOK, NAM, WON-SIK, YEON, KANG-HEUM
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SONG, DAE-SEOK
NAM, WON-SIK
YEON, KANG-HEUM
description The present invention relates to a heat source device, a substrate support device, and a substrate processing facility comprising the same. According to the present invention, a substrate can be uniformly heated and stably supported by a chamber having an inner space where the substrate is treated, and a substrate support device installed in the chamber to stably support the substrate and a heat source device installed in the chamber to uniformly heat the substrate.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202243082A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202243082A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202243082A3</originalsourceid><addsrcrecordid>eNrjZPDzSE0sUSjOLy1KTlVISS3LTE7VUSguTSouKUosSQWyCgryi0qgMgqJeSlIkgVF-cmpxcWZeekKaYnJmTmZJZU8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSQ-JNzIwMjIxNjAwsjRmBg1AE4XNzI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Heat source device, substrate support device and substrate processing facility</title><source>esp@cenet</source><creator>SONG, DAE-SEOK ; NAM, WON-SIK ; YEON, KANG-HEUM</creator><creatorcontrib>SONG, DAE-SEOK ; NAM, WON-SIK ; YEON, KANG-HEUM</creatorcontrib><description>The present invention relates to a heat source device, a substrate support device, and a substrate processing facility comprising the same. According to the present invention, a substrate can be uniformly heated and stably supported by a chamber having an inner space where the substrate is treated, and a substrate support device installed in the chamber to stably support the substrate and a heat source device installed in the chamber to uniformly heat the substrate.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221101&amp;DB=EPODOC&amp;CC=TW&amp;NR=202243082A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221101&amp;DB=EPODOC&amp;CC=TW&amp;NR=202243082A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SONG, DAE-SEOK</creatorcontrib><creatorcontrib>NAM, WON-SIK</creatorcontrib><creatorcontrib>YEON, KANG-HEUM</creatorcontrib><title>Heat source device, substrate support device and substrate processing facility</title><description>The present invention relates to a heat source device, a substrate support device, and a substrate processing facility comprising the same. According to the present invention, a substrate can be uniformly heated and stably supported by a chamber having an inner space where the substrate is treated, and a substrate support device installed in the chamber to stably support the substrate and a heat source device installed in the chamber to uniformly heat the substrate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPDzSE0sUSjOLy1KTlVISS3LTE7VUSguTSouKUosSQWyCgryi0qgMgqJeSlIkgVF-cmpxcWZeekKaYnJmTmZJZU8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSQ-JNzIwMjIxNjAwsjRmBg1AE4XNzI</recordid><startdate>20221101</startdate><enddate>20221101</enddate><creator>SONG, DAE-SEOK</creator><creator>NAM, WON-SIK</creator><creator>YEON, KANG-HEUM</creator><scope>EVB</scope></search><sort><creationdate>20221101</creationdate><title>Heat source device, substrate support device and substrate processing facility</title><author>SONG, DAE-SEOK ; NAM, WON-SIK ; YEON, KANG-HEUM</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202243082A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SONG, DAE-SEOK</creatorcontrib><creatorcontrib>NAM, WON-SIK</creatorcontrib><creatorcontrib>YEON, KANG-HEUM</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SONG, DAE-SEOK</au><au>NAM, WON-SIK</au><au>YEON, KANG-HEUM</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat source device, substrate support device and substrate processing facility</title><date>2022-11-01</date><risdate>2022</risdate><abstract>The present invention relates to a heat source device, a substrate support device, and a substrate processing facility comprising the same. According to the present invention, a substrate can be uniformly heated and stably supported by a chamber having an inner space where the substrate is treated, and a substrate support device installed in the chamber to stably support the substrate and a heat source device installed in the chamber to uniformly heat the substrate.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TW202243082A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Heat source device, substrate support device and substrate processing facility
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T12%3A30%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SONG,%20DAE-SEOK&rft.date=2022-11-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202243082A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true