Temperature-sensitive adhesive and workpiece processing method
A temperature-sensitive adhesive of the present invention contains an ultraviolet curable side chain crystalline polymer that is a reaction product of a compound having a UV-curable functional group and a side-chain crystalline polymer, and exhibits fluidity at temperatures above its melting point,...
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| creator | MEGUMI, TAKASHI KATO, TAKUMI |
| description | A temperature-sensitive adhesive of the present invention contains an ultraviolet curable side chain crystalline polymer that is a reaction product of a compound having a UV-curable functional group and a side-chain crystalline polymer, and exhibits fluidity at temperatures above its melting point, wherein the side-chain crystalline polymer includes a (meth) acrylate having a linear alkyl group having 16 or more carbon atoms, a (meth) acrylate having an alkyl group having 2 to 6 carbon atoms, and a (meth) acrylate having a hydroxyalkyl group as monomer components, and additionally, the (meth) acrylate having a hydroxyalkyl group is contained in the monomer component in a proportion of 6% by weight or more. A workpiece processing method of the present invention comprises a step of irradiating a pressure-sensitive adhesive layer in a temperature-sensitive adhesive tape with ultraviolet rays and peeling the workpiece from the temperature-sensitive adhesive tape at a temperature lower than the melting point. |
| format | Patent |
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A workpiece processing method of the present invention comprises a step of irradiating a pressure-sensitive adhesive layer in a temperature-sensitive adhesive tape with ultraviolet rays and peeling the workpiece from the temperature-sensitive adhesive tape at a temperature lower than the melting point.</description><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; CHEMISTRY ; DYES ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221101&DB=EPODOC&CC=TW&NR=202242061A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221101&DB=EPODOC&CC=TW&NR=202242061A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MEGUMI, TAKASHI</creatorcontrib><creatorcontrib>KATO, TAKUMI</creatorcontrib><title>Temperature-sensitive adhesive and workpiece processing method</title><description>A temperature-sensitive adhesive of the present invention contains an ultraviolet curable side chain crystalline polymer that is a reaction product of a compound having a UV-curable functional group and a side-chain crystalline polymer, and exhibits fluidity at temperatures above its melting point, wherein the side-chain crystalline polymer includes a (meth) acrylate having a linear alkyl group having 16 or more carbon atoms, a (meth) acrylate having an alkyl group having 2 to 6 carbon atoms, and a (meth) acrylate having a hydroxyalkyl group as monomer components, and additionally, the (meth) acrylate having a hydroxyalkyl group is contained in the monomer component in a proportion of 6% by weight or more. 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A workpiece processing method of the present invention comprises a step of irradiating a pressure-sensitive adhesive layer in a temperature-sensitive adhesive tape with ultraviolet rays and peeling the workpiece from the temperature-sensitive adhesive tape at a temperature lower than the melting point.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CHEMISTRY DYES ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| title | Temperature-sensitive adhesive and workpiece processing method |
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