Temperature-sensitive adhesive and workpiece processing method

A temperature-sensitive adhesive of the present invention contains an ultraviolet curable side chain crystalline polymer that is a reaction product of a compound having a UV-curable functional group and a side-chain crystalline polymer, and exhibits fluidity at temperatures above its melting point, wherein the side-chain crystalline polymer includes a (meth) acrylate having a linear alkyl group having 16 or more carbon atoms, a (meth) acrylate having an alkyl group having 2 to 6 carbon atoms, and a (meth) acrylate having a hydroxyalkyl group as monomer components, and additionally, the (meth) acrylate having a hydroxyalkyl group is contained in the monomer component in a proportion of 6% by weight or more. A workpiece processing method of the present invention comprises a step of irradiating a pressure-sensitive adhesive layer in a temperature-sensitive adhesive tape with ultraviolet rays and peeling the workpiece from the temperature-sensitive adhesive tape at a temperature lower than the melting point.