Circuit board and method for manufacturing the same

A method for manufacturing a circuit board, comprising: providing an inner circuit substrate. Covering a single-sided copper clad laminate on a surface of the inner circuit substrate, the single-sided copper clad laminate includes an outer dielectric layer and a bottom copper layer, the bottom copper layer is disposed on a surface of the outer dielectric layer away from the inner circuit substrate. Etching the single-sided copper clad laminate to form a circuit groove, the circuit groove penetrates through the bottom copper layer and a portion of the outer dielectric layer. Forming a copper plating layer in the line groove and on the surface of the bottom copper layer. And etching the copper plating layer and the bottom copper layer for circuit production to form an outer circuit layer to obtain the circuit board, wherein, a part of the outer circuit layer facing the inner circuit substrate is embedded in the outer dielectric layer. The disclosure further provides a circuit board.