Curable silicone composition, cured body and manufacturing thereof, lamination body and manufacturing thereof

To provide: a curable silicone composition having hot-melt properties, the curable silicone composition substantially not requiring use of an organic solvent, being curable using a comparatively low amount of a condensation reaction catalyst, being such that side reactions before and after a curing...

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Bibliographische Detailangaben
1. Verfasser: AMAKO, MASAAKI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:To provide: a curable silicone composition having hot-melt properties, the curable silicone composition substantially not requiring use of an organic solvent, being curable using a comparatively low amount of a condensation reaction catalyst, being such that side reactions before and after a curing reaction are suppressed, and comprising excellent melt-curing properties, wherefore the curable silicone composition can be cured at high speed, and a cured product of the curable silicone composition has adequate adhesion characteristics and mechanical characteristics for practical use; a cured product of the curable silicone composition; and an application of the same. Provided are: a curable silicone composition having hot-melt properties, the curable silicone composition containing a condensation-reaction-catalyst-containing mixture that includes a condensation-reactive organopolysiloxane resin having hot-melt properties, and a condensation reaction catalyst that is a liquid at 25 DEG C (optimally a volatile ul