Method for manufacturing circuit board

Method for manufacturing circuit board

A method for manufacturing a circuit board is provided. A first carrier board included a substrate and a first conductive layer is provided, and the first conductive layer is located on a first surface of the substrate. A stainless steel layer is sputtered on the first conductive layer. A metal laye...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HO, CHUNG-WEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator HO, CHUNG-WEN
description A method for manufacturing a circuit board is provided. A first carrier board included a substrate and a first conductive layer is provided, and the first conductive layer is located on a first surface of the substrate. A stainless steel layer is sputtered on the first conductive layer. A metal layer is formed on the stainless steel layer. A circuit structure layer is formed on the metal layer. A bottom surface of the circuit structure layer is connected to the first carrier board. The interface between the stainless steel layer of the first carrier board and the metal layer is separated, so as to separate the first carrier board and the circuit structure layer. The method for manufacturing the circuit board of the present invention is stable and controllable, and can effectively reduce the manufacturing cost and improve the product yield.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202239277A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202239277A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202239277A3</originalsourceid><addsrcrecordid>eNrjZFDzTS3JyE9RSMsvUshNzCtNS0wuKS3KzEtXSM4sSi7NLFFIyk8sSuFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfEh4UYGRkbGlkbm5o7GxKgBAH-5J9w</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for manufacturing circuit board</title><source>esp@cenet</source><creator>HO, CHUNG-WEN</creator><creatorcontrib>HO, CHUNG-WEN</creatorcontrib><description>A method for manufacturing a circuit board is provided. A first carrier board included a substrate and a first conductive layer is provided, and the first conductive layer is located on a first surface of the substrate. A stainless steel layer is sputtered on the first conductive layer. A metal layer is formed on the stainless steel layer. A circuit structure layer is formed on the metal layer. A bottom surface of the circuit structure layer is connected to the first carrier board. The interface between the stainless steel layer of the first carrier board and the metal layer is separated, so as to separate the first carrier board and the circuit structure layer. The method for manufacturing the circuit board of the present invention is stable and controllable, and can effectively reduce the manufacturing cost and improve the product yield.</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221001&amp;DB=EPODOC&amp;CC=TW&amp;NR=202239277A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221001&amp;DB=EPODOC&amp;CC=TW&amp;NR=202239277A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HO, CHUNG-WEN</creatorcontrib><title>Method for manufacturing circuit board</title><description>A method for manufacturing a circuit board is provided. A first carrier board included a substrate and a first conductive layer is provided, and the first conductive layer is located on a first surface of the substrate. A stainless steel layer is sputtered on the first conductive layer. A metal layer is formed on the stainless steel layer. A circuit structure layer is formed on the metal layer. A bottom surface of the circuit structure layer is connected to the first carrier board. The interface between the stainless steel layer of the first carrier board and the metal layer is separated, so as to separate the first carrier board and the circuit structure layer. The method for manufacturing the circuit board of the present invention is stable and controllable, and can effectively reduce the manufacturing cost and improve the product yield.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDzTS3JyE9RSMsvUshNzCtNS0wuKS3KzEtXSM4sSi7NLFFIyk8sSuFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfEh4UYGRkbGlkbm5o7GxKgBAH-5J9w</recordid><startdate>20221001</startdate><enddate>20221001</enddate><creator>HO, CHUNG-WEN</creator><scope>EVB</scope></search><sort><creationdate>20221001</creationdate><title>Method for manufacturing circuit board</title><author>HO, CHUNG-WEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202239277A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HO, CHUNG-WEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HO, CHUNG-WEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for manufacturing circuit board</title><date>2022-10-01</date><risdate>2022</risdate><abstract>A method for manufacturing a circuit board is provided. A first carrier board included a substrate and a first conductive layer is provided, and the first conductive layer is located on a first surface of the substrate. A stainless steel layer is sputtered on the first conductive layer. A metal layer is formed on the stainless steel layer. A circuit structure layer is formed on the metal layer. A bottom surface of the circuit structure layer is connected to the first carrier board. The interface between the stainless steel layer of the first carrier board and the metal layer is separated, so as to separate the first carrier board and the circuit structure layer. The method for manufacturing the circuit board of the present invention is stable and controllable, and can effectively reduce the manufacturing cost and improve the product yield.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TW202239277A
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Method for manufacturing circuit board
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T13%3A20%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HO,%20CHUNG-WEN&rft.date=2022-10-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202239277A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true