Method for manufacturing circuit board
A method for manufacturing a circuit board is provided. A first carrier board included a substrate and a first conductive layer is provided, and the first conductive layer is located on a first surface of the substrate. A stainless steel layer is sputtered on the first conductive layer. A metal laye...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A method for manufacturing a circuit board is provided. A first carrier board included a substrate and a first conductive layer is provided, and the first conductive layer is located on a first surface of the substrate. A stainless steel layer is sputtered on the first conductive layer. A metal layer is formed on the stainless steel layer. A circuit structure layer is formed on the metal layer. A bottom surface of the circuit structure layer is connected to the first carrier board. The interface between the stainless steel layer of the first carrier board and the metal layer is separated, so as to separate the first carrier board and the circuit structure layer. The method for manufacturing the circuit board of the present invention is stable and controllable, and can effectively reduce the manufacturing cost and improve the product yield. |
|---|