Resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device

This resin composition comprises a bismaleimide compound (A) including a constituent unit represented by formula (1) and containing maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of maleimide compounds other than the bismal...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEDA, MAO, YOSHIZAWA, ERI, YAMAMOTO, KAZUYOSHI, MIZUGUCHI, TAKAHUMI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	This resin composition comprises a bismaleimide compound (A) including a constituent unit represented by formula (1) and containing maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of maleimide compounds other than the bismaleimide compound (A), cyanic acid ester compounds, benzoxazine compounds, epoxy resins, carbodiimide compounds, and compounds having an ethylenically unsaturated group, and a photocuring initiator (C). (In formula (1), R1 represents a linear or branched C1-C16 alkylene group or a linear or branched C2-C16 alkenylene group, R2 represents a linear or branched C1-C16 alkylene group or a linear or branched C2-C16 alkenylene group, the R3 moieties each independently represent a hydrogen atom, a linear or branched C1-C16 alkyl group, or a linear or branched C2-C16 alkenyl group, n1 each independently indicates an integer of 1-4, and n2 each independently indicates an integer of 1-4.).