Crystal ingot slicing device and crystal ingot slicing method

A crystal ingot slicing device and a crystal ingot slicing method are provided. The crystal ingot slicing method is used to implement the crystal ingot slicing device and is configured to cut a crystal ingot into multiple wafers. The crystal ingot slicing device includes two sacrificial members, a plurality of rollers, and at least one cutting line movably wound around the plurality of rollers. The two sacrificial members each have a groove and a top surface, and the two grooves are respectively configured to receive and abut on opposite sides of the crystal ingot. In a cross section view of the two sacrificial members and the crystal ingot, each of the two grooves corresponding to a central axis of the crystal ingot forms a central angle between 60 degrees and 180 degrees. When the at least one cutting line cuts the crystal ingot and the two sacrificial members, the at least one cutting line starts to cut from the top surface of one of the sacrificial members, and then cuts the crystal ingot to form the plur