Grinding apparatus

A grinding apparatus includes a chuck table, a grinding unit, a thickness measuring device for measuring a thickness of the workpiece, and a control unit. The thickness measuring device includes a measuring unit for measuring the thickness of the workpiece and a measuring unit moving mechanism for m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NAGAI, OSAMU, WAKABAYASHI, YOHEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A grinding apparatus includes a chuck table, a grinding unit, a thickness measuring device for measuring a thickness of the workpiece, and a control unit. The thickness measuring device includes a measuring unit for measuring the thickness of the workpiece and a measuring unit moving mechanism for moving the measuring unit back and forth on a measuring track. The control unit controls the measuring unit to measure thicknesses of the workpiece at various points thereon while moving the measuring unit back and forth on the measuring track, calculates a cross-sectional shape of the workpiece from average values of thickness values measured by the measuring unit in a forward stroke on the measuring track and thickness values measured by the measuring unit in a return stroke on the measuring track, and calculates a tilt adjustment variable for a table rotational axis according to the calculated cross-sectional shape.