Sealing composition and semiconductor apparatus

A sealing composition includes an epoxy resin, a curing agent, an inorganic filler, and a non-calcined hydrotalcite compound having a molar ratio of Mg ion and Al ion (Mg/Al) of more than 3.0.

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Bibliographische Detailangaben
Hauptverfasser:	INOUE, YORIKO, KANG, DONGCHUL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A sealing composition includes an epoxy resin, a curing agent, an inorganic filler, and a non-calcined hydrotalcite compound having a molar ratio of Mg ion and Al ion (Mg/Al) of more than 3.0.