Chemical mechanical polishing slurry and method of using the same

The present invention provides a chemical mechanical polishing slurry for carbon-containing materials CMP and a method of use thereof. The chemical mechanical polishing slurry contains abrasives, oxidizers, carboxylic acid compounds and water. While maintaining a high removal rate of carbon-containi...

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Bibliographische Detailangaben
Hauptverfasser:	ZHOU, JAIME JING-YU, LIU, TIAN-QI, CAI, XIN-YUAN, ZHOU, WEN-TING, TANG, HAO-JIE, MA, JEREMY JIAN, CHANG, BIN, JING, JIAN-FEN, YANG, VIOLA JUN-YA, YAO, YING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES
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