Waterborne pressure sensitive adhesive composition with polymodal particle size distribution

The present disclosure is directed to a water-based adhesive composition. In an embodiment, the water-based pressure-sensitive adhesive composition includes a plurality of particles having a polymodal particle size distribution. The particles are composed of (A) a first polymer, and (B) a second pol...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BINDER, JOSEPH B, PUJARI, SASWATI, MANNING, KYLIE B
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present disclosure is directed to a water-based adhesive composition. In an embodiment, the water-based pressure-sensitive adhesive composition includes a plurality of particles having a polymodal particle size distribution. The particles are composed of (A) a first polymer, and (B) a second polymer different than the first polymer. The particles have a d50 greater than 450 nm and a polydispersity index, PDi, from 0.5 to 2.0. (C) The composition has a solids content greater than or equal to 65.5 wt%. Further disclosed are articles with the water-based pressure-sensitive adhesive composition.