Process for depositing a bronze alloy on a printed circuit board and printed circuit board obtained using this process

Process for depositing a bronze alloy on a printed circuit board (5). This process comprises an operation of electrodepositing at least one bronze layer (12) on a sheet of copper (10). The bronze layer (12) comprises, after deposition, 45-65% by weight copper, 30 to 45% by weight tin and 2 to 11% by...

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Bibliographische Detailangaben
Hauptverfasser:	SANSON, JEROME, COQUILLARD, STEPHANIE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Process for depositing a bronze alloy on a printed circuit board (5). This process comprises an operation of electrodepositing at least one bronze layer (12) on a sheet of copper (10). The bronze layer (12) comprises, after deposition, 45-65% by weight copper, 30 to 45% by weight tin and 2 to 11% by weight zinc. Printed circuit board (5) obtained using this process.