Compound and composition

The purpose of the present invention is to provide a composition for forming a cured product having excellent heat resistance and solvent resistance. The present invention provides a compound that is represented by general formula (I) and that has one or more reactive groups in a molecule. In the formula, A represents a C6 hydrocarbon ring; X1 and X2 each represent a reactive group, a C6-30 aryl group in which a group having a reactive group may be substituted, or the like; R1, R2, R3, R4, R6, R7, R8, and R9 each represent a hydrogen atom, a reactive group, a C1-20 hydrocarbon group in which a reactive group may be substituted, or the like; and R5 and R10 each represent a hydrogen atom, a C1-20 hydrocarbon group in which a reactive group may be substituted, or the like.