Burn-in board provided with backside cooling mechanism

The disclosure provides a burn-in board including a circuit board, a first thermal conducting interface, a second thermal conducting interface and a fan. The first thermal conducting interface contacts with a backside of the circuit board at an area corresponding to a DUT. The second conducting inte...

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Bibliographische Detailangaben
Hauptverfasser:	SUN, WEIIH, SUNG, TINGIEN, CHEN, YUN-HAN, LIU, SHAOI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS
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Beschreibung
Zusammenfassung:	The disclosure provides a burn-in board including a circuit board, a first thermal conducting interface, a second thermal conducting interface and a fan. The first thermal conducting interface contacts with a backside of the circuit board at an area corresponding to a DUT. The second conducting interface is vertically stacked on the first conducting interface, and the first conducting interface and the second conducting interface are different materials. The fan electrically couples to the backside of the circuit board and configured to provide a lateral airflow along the backside.