Electroplating device and electroplating method

Electroplating device and electroplating method

The invention discloses an electroplating device and an electroplating method. The electroplating device comprises an electroplating unit used for electroplating a production board, and the electroplating unit comprises an electrolyte channel used for spraying electrolyte towards the production boar...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: MARCUS ELMAR, LANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:The invention discloses an electroplating device and an electroplating method. The electroplating device comprises an electroplating unit used for electroplating a production board, and the electroplating unit comprises an electrolyte channel used for spraying electrolyte towards the production board and an electroplating assembly arranged on the outer surface of the electrolyte channel. The electroplating assembly comprises an anode arranged on the outer surface of the electrolyte channel and a suction channel which is arranged in the anode and is used for absorbing the electrolyte in the direction opposite to the spraying and plating direction. According to the electroplating device and the electroplating method, the electrolyte channel and the electroplating assembly are combined for use, so that the electrolyte can be uniformly electroplated on the production board.