Photosensitive resin composition containing epoxy resin and cured product thereof

The subject of the present invention provides a photosensitive resin composition and a cured product thereof. The photosensitive resin composition has excellent sensitivity to active energy rays, can be developed with a developed alkali aqueous solution to lighography form of fine pattern, and that...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEDA, MAO, KAGA, TAIKI, MIZUGUCHI, TAKAHUMI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The subject of the present invention provides a photosensitive resin composition and a cured product thereof. The photosensitive resin composition has excellent sensitivity to active energy rays, can be developed with a developed alkali aqueous solution to lighography form of fine pattern, and that has high insulativity, bonding, developer, heat resistance, resistance to electroless gold plating, can be formed a film with excellent flexibility and tough elastic modulus. The photosensitive resin composition of the present invention as a means of solving the above-mentioned problems contains: carboxyl-containing photosensitive resin, a cross-linking agent, a photopolymerization initiator, and a curing agent, and the photosensitive resin is obtained by using the epoxy resin having a compound with a structure of general formula (1) as a curing agent. When the photosensitive resin composition is cured by ultraviolet exposure to form a coating film, it has excellent photosensitivity and can be developed. The result