Laser processing method of printed circuit board and laser processing machine for printed circuit board

A laser processing method of a printed circuit board that processes a workpiece by irradiating the workpiece with a laser output from a laser output device whose output is controlled by a high-frequency pulse RF output, the method comprising: providing a unit configured to obtain time t0 from a time...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ISHII, KAZUHISA, NISHIMURA, TOSHIYA, NISHIBE, TATSUYA, ARAI, KUNIO, KANAYA, YASUHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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