Laser processing method of printed circuit board and laser processing machine for printed circuit board

A laser processing method of a printed circuit board that processes a workpiece by irradiating the workpiece with a laser output from a laser output device whose output is controlled by a high-frequency pulse RF output, the method comprising: providing a unit configured to obtain time t0 from a time...

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Bibliographische Detailangaben
Hauptverfasser:	ISHII, KAZUHISA, NISHIMURA, TOSHIYA, NISHIBE, TATSUYA, ARAI, KUNIO, KANAYA, YASUHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A laser processing method of a printed circuit board that processes a workpiece by irradiating the workpiece with a laser output from a laser output device whose output is controlled by a high-frequency pulse RF output, the method comprising: providing a unit configured to obtain time t0 from a time when the high-frequency pulse RF output is turned on to a time when the laser is actually output in advance and change a traveling direction of the laser in an optical path of the laser; irradiating the workpiece with all the lasers while the high-frequency pulse RF output is turned on; and removing at least a part of the laser from the workpiece simultaneous with turning off the high-frequency pulse RF output.