Grinding method of workpiece capable of reliably grinding a workpiece with high efficiency

The object of the present invention is to high efficiently and reliably grind a workpiece. A grinding method for grinding a workpiece includes: a first grinding step of grinding the workpiece in such a manner that an outer circumferential part of the workpiece becomes thinner than a central part of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	FUJIMURA, SATORU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The object of the present invention is to high efficiently and reliably grind a workpiece. A grinding method for grinding a workpiece includes: a first grinding step of grinding the workpiece in such a manner that an outer circumferential part of the workpiece becomes thinner than a central part of the workpiece; a measurement step of measuring the thickness of the workpiece at the outer circumferential part, or a height of an upper surface of the workpiece at the outer circumferential part; and a second grinding step of grinding the workpiece. In the second grinding step, the grinding is started from the central part of the workpiece and the grinding is ended when the workpiece has a finished product thickness reached. The finished product thickness is decided based on the thickness of the workpiece at the outer circumferential part or the height of the upper surface of the workpiece at the outer circumferential part measured in the measurement step.