Apparatus and method for performing tests on interconnect bonds

An interconnect bond test apparatus for testing a bond strength of an electronic device includes at least one interconnect bond attached to the electronic device. The interconnect bond test apparatus has a positioning mechanism and a test tool assembly mounted onto the positioning mechanism. The tes...

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Bibliographische Detailangaben
Hauptverfasser:	SONG, KENG YEW, CHEN, JIAN-MIN, LEE, ZUI HONG, TAN, KIEN KIA, GOH, MOW HUAT
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS TESTING TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR
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Beschreibung
Zusammenfassung:	An interconnect bond test apparatus for testing a bond strength of an electronic device includes at least one interconnect bond attached to the electronic device. The interconnect bond test apparatus has a positioning mechanism and a test tool assembly mounted onto the positioning mechanism. The test tool assembly is configured to push a first portion of the interconnect bond and to pull a second portion of the interconnect bond. The positioning mechanism is operative to align the test tool assembly to the interconnect bond during testing, and to apply a pushing force on the first portion of the interconnect bond and a pulling force on the second portion of the interconnect bond. The interconnect bond test apparatus has a jig including at least one force sensing element mounted on the jig. The at least one force sensing element is configured to exert a resistance force on the test tool assembly when it is engaged by the test tool assembly.