Photosensitive resin composition which can form a cured product that does not impair basic properties such as adhesion to a substrate having a circuit pattern and electrical insulation and is excellent in coating, flame retardancy and gold plating resistance for inkjet application

The subject of the present invention is to provide a photosensitive resin composition, which can form a cured product that does not impair basic properties such as adhesion to a substrate having a circuit pattern and electrical insulation and is excellent in coating, flame retardancy and gold plating resistance for inkjet application. The solution of the photosensitive resin composition for inkjet of the present invention comprises: (A) a (meth)acrylic compound having a weight average molecular weight of 500 or more, (B) a (meth)acrylic compound having a weight average molecular weight of less than 500, (C) a phosphorus-containing flame retardant, (D) an amine-modified (meth)acrylic compound, and (E) a photopolymerization initiator, wherein the (C) phosphorus-containing flame retardant has a functional group that can be cured by an active energy ray, and the (D) amine-modified (meth)acrylic compound has a functional group that can be cured by an active energy ray.