Adhesive layer, and method for depositing conductive layer on inorganic or organic-inorganic hybrid substrate and conductive structure

Provided are an adhesive layer, and a method for depositing a conductive layer on an inorganic or organic-inorganic hybrid substrate and a conductive structure. The adhesive layer is suitable for depositing a conductive layer onto an inorganic or organic-inorganic hybrid substrate, and includes a me...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG, WEI-YEN, HUANG, MENGI, CHANG, YIU-HSIANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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