Adhesive layer, and method for depositing conductive layer on inorganic or organic-inorganic hybrid substrate and conductive structure

Adhesive layer, and method for depositing conductive layer on inorganic or organic-inorganic hybrid substrate and conductive structure

Provided are an adhesive layer, and a method for depositing a conductive layer on an inorganic or organic-inorganic hybrid substrate and a conductive structure. The adhesive layer is suitable for depositing a conductive layer onto an inorganic or organic-inorganic hybrid substrate, and includes a me...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WANG, WEI-YEN, HUANG, MENGI, CHANG, YIU-HSIANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:Provided are an adhesive layer, and a method for depositing a conductive layer on an inorganic or organic-inorganic hybrid substrate and a conductive structure. The adhesive layer is suitable for depositing a conductive layer onto an inorganic or organic-inorganic hybrid substrate, and includes a metal oxide layer and an interface layer. The metal oxide layer is disposed on the inorganic or organic-inorganic hybrid substrate. The interface layer is disposed between the metal oxide layer and the inorganic or organic-inorganic hybrid substrate. The metal oxide layer includes metal oxide and a chelating agent. The interface layer includes the metal oxide, the chelating agent and metal-nonmetal-oxide composite material.