Methods and apparatus for backside via reveal processing

Methods and apparatus perform backside via reveal processes using a centralized control framework for multiple process tools. In some embodiments, a method for performing a backside via reveal process may include receiving process tool operational parameters from process tools involved in the backsi...

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Bibliographische Detailangaben
Hauptverfasser:	GAN, PIN GIAN, SEE, GUAN HUEI, ATHAYDE, AMULYA LIGORIO, MORI, GLEN T, WYLIE, MARK MCTAGGART, HUNG, SHIHAO, LIANTO, PRAYUDI, MEHTA, GAURAV, CHIDAMBARAM, RAMESH, VINLUAN, RICARDO FUJII, CHI, SIK HIN, KEW, WEI HAO, SUNDARRAJAN, ARVIND, ABDULLAH, MUHAMMAD ADLI DANISH BIN, KUTNEY, MICHAEL CHARLES, UMMETHALA, UPENDRA V
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Methods and apparatus perform backside via reveal processes using a centralized control framework for multiple process tools. In some embodiments, a method for performing a backside via reveal process may include receiving process tool operational parameters from process tools involved in the backside via reveal process by a central controller, receiving sensor metrology data from at least one or more of the process tools involved in the backside via reveal process, and altering the backside reveal process based, at least in part, on the process tool operational parameters and the sensor metrology data by adjusting two or more of the process tools involved in the backside via reveal process. The profile parameters are configured to prevent backside via breakage during a chemical mechanical polishing (CMP) process.