Chip packaging method and chip package unit
The present invention discloses a chip packaging method, which includes: providing a plurality of chip units; providing a substrate, and placing the chip units on the substrate; providing an adhesive layer and a metal foil, and adhering the metal film on the chip units by the adhesive layer; and cut...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | The present invention discloses a chip packaging method, which includes: providing a plurality of chip units; providing a substrate, and placing the chip units on the substrate; providing an adhesive layer and a metal foil, and adhering the metal film on the chip units by the adhesive layer; and cutting the chip units on the substrate into a plurality of separate chip package units, wherein each of the chip package unit includes the cut metal foil. |
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