Interposer and manufacturing method thereof

Interposer and manufacturing method thereof

An interposer for disposing a semiconductor chip and an external terminal at two opposing sides and a manufacturing method thereof are provided. The interposer includes a first redistribution structure, a second redistribution structure disposed over and electrically coupled to the first redistribut...

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1. Verfasser: HU, DYIUNG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description An interposer for disposing a semiconductor chip and an external terminal at two opposing sides and a manufacturing method thereof are provided. The interposer includes a first redistribution structure, a second redistribution structure disposed over and electrically coupled to the first redistribution structure, and an active device interposed between the first redistribution structure and the second redistribution structure. The semiconductor chip is disposed on and electrically connected to the first redistribution structure. A dimension of a first conductive pattern of the first redistribution structure is less than that of a second conductive pattern of the second redistribution structure, and the external terminal is disposed on and electrically connected to the second redistribution structure. An active surface of the active device is in contact with the first redistribution structure, and the active device is electrically coupled to the second redistribution structure through the first redistribution
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Interposer and manufacturing method thereof
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