Interposer and manufacturing method thereof
An interposer for disposing a semiconductor chip and an external terminal at two opposing sides and a manufacturing method thereof are provided. The interposer includes a first redistribution structure, a second redistribution structure disposed over and electrically coupled to the first redistribut...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | An interposer for disposing a semiconductor chip and an external terminal at two opposing sides and a manufacturing method thereof are provided. The interposer includes a first redistribution structure, a second redistribution structure disposed over and electrically coupled to the first redistribution structure, and an active device interposed between the first redistribution structure and the second redistribution structure. The semiconductor chip is disposed on and electrically connected to the first redistribution structure. A dimension of a first conductive pattern of the first redistribution structure is less than that of a second conductive pattern of the second redistribution structure, and the external terminal is disposed on and electrically connected to the second redistribution structure. An active surface of the active device is in contact with the first redistribution structure, and the active device is electrically coupled to the second redistribution structure through the first redistribution |
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