Semiconductor package, electronic equipment, and manufacturing method of electronic equipment

Semiconductor package, electronic equipment, and manufacturing method of electronic equipment

According to the present invention, information pertaining to a semiconductor package (10) is described not on an upper surface (11a) of a semiconductor chip (11), but on a stiffener (14) that is located outside the outer edge (11d) of the semiconductor chip (11) and inside the outer edge (17d) of a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUGAWARA, NOBUYUKI, KAMBAYASHI, ASUKA, SUZUKI, RYO
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:According to the present invention, information pertaining to a semiconductor package (10) is described not on an upper surface (11a) of a semiconductor chip (11), but on a stiffener (14) that is located outside the outer edge (11d) of the semiconductor chip (11) and inside the outer edge (17d) of a package base material (17). A heat conductive material (31) having fluidity is disposed between the upper surface (11a) of the semiconductor chip (11) and a heat radiator (50). Accordingly, high cooling performance can be ensured for the semiconductor chip.