Ball loading method and ball loading apparatus including a flux printing process (steps S1 to S4) for printing a flux on an electrode by using a gravure offset printing method
This invention relates to a ball loading method for loading a conductive ball on a predetermined electrode of a wafer (substrate). The ball loading method includes a flux printing process (steps S1 to S4) for printing a flux on an electrode by using a gravure offset printing method and a ball loadin...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | This invention relates to a ball loading method for loading a conductive ball on a predetermined electrode of a wafer (substrate). The ball loading method includes a flux printing process (steps S1 to S4) for printing a flux on an electrode by using a gravure offset printing method and a ball loading process (steps S5 to S8) for loading a ball on the flux. This invention may provide a ball loading method capable of achieving a higher fineness ball loading. |
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