Ball loading method and ball loading apparatus including a flux printing process (steps S1 to S4) for printing a flux on an electrode by using a gravure offset printing method

This invention relates to a ball loading method for loading a conductive ball on a predetermined electrode of a wafer (substrate). The ball loading method includes a flux printing process (steps S1 to S4) for printing a flux on an electrode by using a gravure offset printing method and a ball loadin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAMAMOTO, HIDEO, KOBAYASHI, DAISUKE, YAMAGISHI, AKITAKA, UENO, TAKESHI, IWATA, HIDEKI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:This invention relates to a ball loading method for loading a conductive ball on a predetermined electrode of a wafer (substrate). The ball loading method includes a flux printing process (steps S1 to S4) for printing a flux on an electrode by using a gravure offset printing method and a ball loading process (steps S5 to S8) for loading a ball on the flux. This invention may provide a ball loading method capable of achieving a higher fineness ball loading.