Polishing material, composition for polishing, and polishing method

Provided are: a polishing material which is capable of removing rolling of the outer surface of a resin coating film by polishing and is not susceptible to the formation of polishing scratches; a composition for polishing; and a polishing method. This composition for polishing contains a polishing m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA, EIICHI, TAMAI, KAZUSEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SKI WAXES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided are: a polishing material which is capable of removing rolling of the outer surface of a resin coating film by polishing and is not susceptible to the formation of polishing scratches; a composition for polishing; and a polishing method. This composition for polishing contains a polishing material which is composed of aluminum oxide particles having a specific surface area of from 5 m2/g to 50 m2/g (inclusive) and an average secondary particle diameter of from 0.05 [mu]m to 4.8 [mu]m (inclusive). This composition for polishing is used for polishing of the outer surface of a resin coating film.