Polyimide resin, polyamic acid, varnish, and polyimide film

A polyimide resin containing structural units A derived from a tetracarboxylic dianhydride and structural units B derived from a diamine, wherein the structural units A include a structural unit (A1) derived from a compound represented by formula (a1) shown below, and the structural units B include...

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Bibliographische Detailangaben
Hauptverfasser:	ABIKO, YOHEI, HOSHINO, SHUN, ISHII, KENTARO, MURAYA, TAKAHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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Beschreibung
Zusammenfassung:	A polyimide resin containing structural units A derived from a tetracarboxylic dianhydride and structural units B derived from a diamine, wherein the structural units A include a structural unit (A1) derived from a compound represented by formula (a1) shown below, and the structural units B include a structural unit (B1) derived from the compound represented by formula (b1) shown below. (In the formula, each R independently represents a methyl group or a trifluoromethyl group, and n is an integer from 1 to 4.).