Processing technology to improve the convenience of EMI removal film

A processing technology to improve the convenience of EMI removal film, Step S1, pulling ears making; Step S2, preparation of fixtures; Step S3, bottom EMI fit; Step S4, FPC fit; Step S5, top EMI fit; Step S6, FPC pre-compression; Step S7, removal the PET film on the EMI surface; Step S8, FPC fast p...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LU, CHUN-HSIEN, CAO, YU-SHAN, ZHONG, FU-FA, MA, ZU-PENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A processing technology to improve the convenience of EMI removal film, Step S1, pulling ears making; Step S2, preparation of fixtures; Step S3, bottom EMI fit; Step S4, FPC fit; Step S5, top EMI fit; Step S6, FPC pre-compression; Step S7, removal the PET film on the EMI surface; Step S8, FPC fast pressing; Step S9, removal film treatment after placing EMI, EMI adhesive side down, PI tape anti-adhesive film adhesive side up, place it on the equipment workbench. Start the device and drive the tape wheel to roll back and forth on the upper surface of the EMI from left to right, so that after the PI tape and the pulling ears are in contact, the EMI transfer film is torn off directly.