Method for manufacturing cylindrical sputtering target, and cylindrical sputtering target

This method for manufacturing a cylindrical sputtering target has: a primary coating step for forming a primary coat layer, by using a primary coat solder made of In, Sn, or an Sn-In alloy, on a joint surface of each of a cylindrical sputtering target material and a backing tube; an assembling step...

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Bibliographische Detailangaben
Hauptverfasser:	OKANO, SHIN, OHTOMO, TAKESHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	This method for manufacturing a cylindrical sputtering target has: a primary coating step for forming a primary coat layer, by using a primary coat solder made of In, Sn, or an Sn-In alloy, on a joint surface of each of a cylindrical sputtering target material and a backing tube; an assembling step for assembling the sputtering target material and the backing tube after the primary coating step; and a solder joining step for joining the assembled sputtering target material and the backing tube by using joining solder made of an Sn-In-Zn-based alloy containing Sn, In, and Zn.