Conductive adhesive composition
An objective of the present invention is enabling realization of good adhesive strength in a conductive adhesive composition containing a conductive powder and a curable component. The conductive adhesive composition according to the present invention contains (A) a conductive powder and (B) a curab...
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| creator | ARAI, TAKAMITSU TOMEKAWA, SATORU KASUGAI, TAKAYUKI OCHIAI, NOBUO |
| description | An objective of the present invention is enabling realization of good adhesive strength in a conductive adhesive composition containing a conductive powder and a curable component. The conductive adhesive composition according to the present invention contains (A) a conductive powder and (B) a curable component wherein the content of (B) the curable component is 20 parts by mass or more when (A) the conductive powder is taken as 100 parts by mass, and the conductive adhesive composition further contains (C) a phosphoric acid-containing curable component having the following general formula (1) or (2) and having a molecular weight in the range of 150 to 1000. X in the formula (1) or (2) is a hydrogen atom (H) or a methyl group (CH3). When the total amount of (A) the conductive powder and (B) the curable component is taken as 100 parts by mass, the content of (C) the phosphoric acid-containing curable component is 0.01 part by mass or more and 5 parts by mass or less. |
| format | Patent |
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The conductive adhesive composition according to the present invention contains (A) a conductive powder and (B) a curable component wherein the content of (B) the curable component is 20 parts by mass or more when (A) the conductive powder is taken as 100 parts by mass, and the conductive adhesive composition further contains (C) a phosphoric acid-containing curable component having the following general formula (1) or (2) and having a molecular weight in the range of 150 to 1000. X in the formula (1) or (2) is a hydrogen atom (H) or a methyl group (CH3). 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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | Conductive adhesive composition |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T04%3A45%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ARAI,%20TAKAMITSU&rft.date=2022-04-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202214804A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |