Conductive adhesive composition

An objective of the present invention is enabling realization of good adhesive strength in a conductive adhesive composition containing a conductive powder and a curable component. The conductive adhesive composition according to the present invention contains (A) a conductive powder and (B) a curable component wherein the content of (B) the curable component is 20 parts by mass or more when (A) the conductive powder is taken as 100 parts by mass, and the conductive adhesive composition further contains (C) a phosphoric acid-containing curable component having the following general formula (1) or (2) and having a molecular weight in the range of 150 to 1000. X in the formula (1) or (2) is a hydrogen atom (H) or a methyl group (CH3). When the total amount of (A) the conductive powder and (B) the curable component is taken as 100 parts by mass, the content of (C) the phosphoric acid-containing curable component is 0.01 part by mass or more and 5 parts by mass or less.