Package structure with excellent adhesion and packaging method for enhancing adhesion

This invention provides a package structure with excellent adhesion, which comprises a substrate defining an effective area and a dummy area surrounding said effective area, a wiring layer disposed on said substrate, a mask layer disposed on said wiring layer, and an epoxy layer disposed on said mask layer. Said wiring layer, said mask layer, and said epoxy layer cover said effective area and said dummy area of said substrate. Said wiring layer includes a predetermined pattern locating on said dummy area and defining a plurality empty area such that exposure said substrate. Said mask layer includes a plurality through holes connecting said corresponding empty areas and exposed said substrate. A size of each said through hole of said mask layer is smaller than a size of said corresponding empty area of said wiring layer such that compose a plurality of filling spaces between said through holes of said mask layer and said empty areas of said wiring layer. Said epoxy layer fills into said filling spaces and has