Method for bonding and debonding two substrates
The invention relates to a method for the temporary bonding of a product substrate with a carrier substrate and for the debonding of a product substrate from a carrier substrate, corresponding devices and a substrate stack.
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | The invention relates to a method for the temporary bonding of a product substrate with a carrier substrate and for the debonding of a product substrate from a carrier substrate, corresponding devices and a substrate stack. |
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