Transparent adhesive composition, film-like transparent adhesive, method for manufacturing transparent adhesive cured layer-provided member, and electronic component and method for manufacturing same

The present invention pertains to: a transparent adhesive composition which contains an epoxy resin (A), an epoxy resin curing agent (B), and a phenoxy resin (C), and in which the epoxy resin curing agent (B) satisfies (1) and (2); a film-like transparent adhesive obtained by processing said composi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MORITA, MINORU, SAKAI, KOYUKI, WATAHIKI, KEITA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention pertains to: a transparent adhesive composition which contains an epoxy resin (A), an epoxy resin curing agent (B), and a phenoxy resin (C), and in which the epoxy resin curing agent (B) satisfies (1) and (2); a film-like transparent adhesive obtained by processing said composition; and a method for manufacturing a transparent adhesive cured layer-provided member, a method for manufacturing an electronic component, and an electronic component, all of which using said film-like transparent adhesive. (1) Being a powder and having a particle diameter (d90) at a cumulative distribution frequency of 90% of 2.0 [mu]m or less. (2) Having a solubility of 0.1 g or less with respect to 100 g of methyl ethyl ketone at 25 DEG C.