Copper foil and laminate, and manufacturing methods therefor

The purpose of the present invention is to provide a copper foil, with which a wiring board capable of exhibiting both RF characteristics and a high peeling strength can be fabricated using a resin base material made of LCP. The copper foil has a surface, a part or the entirety of which is provided...

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Bibliographische Detailangaben
Hauptverfasser:	SATO, MAKIKO, KOKAJI, YOSHINOBU, OBATA, NAOKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS BASED THEREON DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a copper foil, with which a wiring board capable of exhibiting both RF characteristics and a high peeling strength can be fabricated using a resin base material made of LCP. The copper foil has a surface, a part or the entirety of which is provided with irregularities having: an Ra of 0.01-0.10 [mu]m inclusive and an RSm of 1.20-4.00 [mu]m inclusive; an Rz of 0.1-0.90 [mu]m inclusive and an RSm of 1.20-4.00 [mu]m inclusive; or an Ra of 0.034-0.092 [mu]m inclusive, an Rz of 0.25-0.87 [mu]m inclusive, and an RSm of 1.21-3.57 [mu]m inclusive.