Phenoxy resin, resin composition, cured product, laminate for electric/electronic circuits, and method for producing phenoxy resin

The present invention provides a phenoxy resin which has excellent dielectric characteristics and excellent heat resistance. A phenoxy resin containing a polycarbodiimide which is represented by general formula (1) and has a weight average molecular weight of from 10,000 to 200,000. (In the formula,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SATO, HIROSHI, AKIBA, KEITA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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