Phenoxy resin, resin composition, cured product, laminate for electric/electronic circuits, and method for producing phenoxy resin

The present invention provides a phenoxy resin which has excellent dielectric characteristics and excellent heat resistance. A phenoxy resin containing a polycarbodiimide which is represented by general formula (1) and has a weight average molecular weight of from 10,000 to 200,000. (In the formula,...

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Bibliographische Detailangaben
Hauptverfasser:	SATO, HIROSHI, AKIBA, KEITA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a phenoxy resin which has excellent dielectric characteristics and excellent heat resistance. A phenoxy resin containing a polycarbodiimide which is represented by general formula (1) and has a weight average molecular weight of from 10,000 to 200,000. (In the formula, X represents a divalent group containing a dioxy group; each Y independently represents a hydrogen atom or a glycidyl group; n represents a number from 15 to 500; each Z independently represents a hydrogen atom or formula (1a), and at least one Z represents formula (1a); each R independently represents a divalent hydrocarbon group having from 1 to 18 carbon atoms; m represents a number from 2 to 50; and Q represents a residue that is obtained by removing a hydrogen atom from one hydroxyl group of general formula (2).).