Halogen free very low loss resin composition

Provided herein are phosphorus-based flame retardant compounds that provide both good electrical characteristics and good heat resistance characteristics when incorporated into PCB compositions. In particular, provided herein are new organophosphorus-based polymers that contain C=C double bonds, whi...

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Bibliographische Detailangaben
Hauptverfasser:	BAO, EMERSON, YE, SIMON SI-YU, WANG, ETHAN YI-SEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Provided herein are phosphorus-based flame retardant compounds that provide both good electrical characteristics and good heat resistance characteristics when incorporated into PCB compositions. In particular, provided herein are new organophosphorus-based polymers that contain C=C double bonds, which allows them react with other components (for example, C=C bond capped polyphenyl ether, unsaturated hydrocarbon resin, bismaleic imide, etc.) to form a crosslinked network.