Substrate processing monitoring

A method for processing a substrate within a processing chamber comprises receiving a first radiation signal corresponding to a film on a target element disposed within the processing chamber, analyzing the first radiation signal, and controlling the processing of the substrate based on the analyzed...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHU, SCHUBERT S, ZHU, ZUOMING, CHANG, FLORA FONG-SONG, YE, ZHIYUAN, LIN, JENNY C, MARATH SANKARATHODI, BINDUSAGAR, SANCHEZ, ERROL C, CHOO, ENLE, LAU, SHU-KWAN, CONG, ZHEPENG, MORADIAN, ALA, LIU, PATRICIA M, JAMPANA, BALAKRISHNAM R, NESTOROV, VILEN K, SRIVASTAVA, SURENDRA SINGH, SHAPOSHNIKOV, MAXIM D
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A method for processing a substrate within a processing chamber comprises receiving a first radiation signal corresponding to a film on a target element disposed within the processing chamber, analyzing the first radiation signal, and controlling the processing of the substrate based on the analyzed first radiation signal. The processing chamber includes a substrate support configured to support the substrate within a processing volume and a controller coupled to a first sensing device configured to receive the first radiation signal.