Active bridge enabled co-packaged photonic transceiver

Active bridge enabled co-packaged photonic transceiver

Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with th...

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Bibliographische Detailangaben
Hauptverfasser: LIAO, LING, BROWN, KENNETH, JAUSSI, JAMES E, MAHAJAN, RAVINDRANATH, LILJEBERG, THOMAS, DESHPANDE, NITIN A, PARTHASARATHY, BHARADWAJ, ALDUINO, ANDREW C
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
TRANSMISSION
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Beschreibung
Zusammenfassung:Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.